3DIC Compiler
No reviews yetA comprehensive solution for multi-die design, enabling fast heterogeneous integration and advanced packaging.
Simulation Software
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Features
Enable early architecture exploration for optimal system performance
Facilitate rapid software development and system validation
Optimize multi-die and advanced package co-design with multiphysics analysis
Ensure robust die-to-die and chip-to-chip connectivity
Improve manufacturing and reliability of multi-die systems
Perform efficient power and thermal planning
Support early multi-die software bring-up, debug, and analysis
Integrate and test software using virtual die models
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