S
Synopsys

Icepak

No reviews yet

A thermal analysis tool that helps in the design of efficient cooling systems for electronic devices.

Simulation Software

Product tour

No media yet
Screenshots and product tours appear here once the vendor claims this page.

Features

Perform thermal analysis for electronic devices
Design efficient cooling systems
Integrate thermal analysis with electrical and mechanical simulations
Optimize power, performance, and area (PPA) outcomes
Enable early insight and high-accuracy signoff
Reduce risk across the entire design flow
Model delay impacts due to IR-drop and thermo-mechanical stress
Improve correlation between in-design analysis and final signoff

User reviews(0)

Let us know what you think