Multiphysics 3DIC Package Analysis
No reviews yetA tool for analyzing 3DIC packages, integrating thermal, mechanical, and electrical analysis for comprehensive design validation.
Simulation Software
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Features
Integrate thermal, mechanical, and electrical analysis for comprehensive design validation
Enable earlier insight and higher-accuracy signoff
Model delay impacts due to IR-drop and thermo-mechanical stress
Evaluate timing with realistic power and temperature conditions
Reduce over conservative margins without sacrificing reliability
Improve correlation between in-design analysis and final signoff
Optimize silicon performance with PPA-optimized convergence
Conduct stress-aware analyses directly into timing signoff
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